- Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.
- It is used for Maintaining A Positive Heat-Sink Seal That Improves Heat Transfer From The Electrical / Electronic Component / Device To The Heat Sink Or Chassis Thereby Increasing The Overall Efficiency Of The Component / Device.
HY510 Heat Sink Compound
Rs. 300.00
- Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.
- It is used for Maintaining A Positive Heat-Sink Seal That Improves Heat Transfer From The Electrical / Electronic Component / Device To The Heat Sink Or Chassis Thereby Increasing The Overall Efficiency Of The Component / Device.
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HY510 Heat Sink Compound
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